Electronic Components – Superwell Technology Việt Nam

Array

superwellvn — Wed, 14 Oct 2020 07:46:33 +0000

As various electronic products such as portable devices have gotten smaller, several chips have been unified in order to secure mounting space. This reduces the cost of mounting and the ripple voltage.
High Performance & Space Saving
High Performance Product for the Mounting Area Reduction

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Low ESL

superwellvn — Wed, 14 Oct 2020 07:39:58 +0000

MLCCs with low equivalent series inductance (ESL) can be used in circuits with limited mounting area, as a small quantity of such MLCCs can sufficiently replace high-speed IC MLCCs.
Faster Energy Transfer
Saving Space by One Chip

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Low Acoustic Noise

superwellvn — Wed, 14 Oct 2020 07:27:24 +0000

MLCC tremors can occur due to piezoelectric phenomena in electronic devices. These tremors are transmitted to the substrate, causing the substrate to tremble, producing audible noise (20Hz~20kHz). Low Acoustic Noise products are a solution that can effectively reduce this noise.
Reducing Audible Noise
A Solution to Reduce the Noise of Mechanical Vibrations caused by Piezoelectric Properties
Pin to Pin Solution
A Solution to Establish Noise Reduction Measures by Replacing Existing Products Immediately

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Fail Safe(Soft Termination 5mm)

superwellvn — Wed, 14 Oct 2020 07:19:01 +0000

Series Design
Designed to operate like two MLCCs in a series
Even if a defect such as a crack occurs on one side, the circuit can be protected on the other side
5mm Bending Guarantee
Guarantee No Bending Cracks for Board Flex 5mm Variants

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ESD Protection

superwellvn — Wed, 14 Oct 2020 06:56:13 +0000

Specialized for use in protecting circuits from ESD, this component guarantees a higher level of ESD than typical MLCC products. It meets the IEC 61000-4-2 standard.
IEC 61000-4-2 Standard ESD Testing according to the IEC 61000-4-2 Standard
DC Bias Stability Improved DC Bias Characteristics Compared to General MLCC

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High Bending Strength(General)

superwellvn — Wed, 14 Oct 2020 06:44:30 +0000

The thermal/mechanical stress on the chip can be reduced by the ductile properties of Soft Termination. It is also resistant to stress caused by board bending.
Relax The Applied External Stress
Able to Reduce External Thermal/Mechanical Stress on the Chip
Excellent Bending Strength

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Embedded/LSC

superwellvn — Wed, 14 Oct 2020 04:49:28 +0000

This can be mounted between the solder balls to deal with thin devices or modules. It can reduce the thickness of the module or be embedded inside the board to secure the mounting area. It can supply current quickly in a stable manner to high-speed AP of mobile devices. In addition it helps remove high-frequency noise, suffering less from external environmental stress.
Thin in terms of Thickness
A thickness that is appropriate for the thin device and module
Removing High Frequency Noise

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RNL Conductive Polymer Aluminum Solid Electrolytic Capacitors

superwellvn — Wed, 14 Oct 2020 04:28:01 +0000

Low ESR, High Capacitance, High ripple current.
Large Sized.
Load life of 2000 hours at 105°C.
Radial lead type : Lead free flow soldering condition correspondence.
Compliant to the RoHS directive (2011/65/EU,(EU)2015/863).

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UCH chip type, low temperature, aluminum electrolytic capacitor

superwellvn — Wed, 14 Oct 2020 04:07:28 +0000

Chip Type, High Reliability. Low temperature ESR specification.
Added ESR specification after the test at -40°C.
Applicable to automatic mounting machine fed with carrier tape.
Compliant to the RoHS directive (2011/65/EU,(EU)2015/863).
AEC-Q200 compliant.

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UCV Chip type, Low Impedance

superwellvn — Wed, 14 Oct 2020 03:57:50 +0000

Chip type, low impedance temperature range up to +105°C.
Applicable to automatic mounting machine fed with carrier tape.
Compliant to the RoHS directive (2011/65/EU,(EU)2015/863).
AEC-Q200 compliant.

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