Ceramic capacitor – Superwell Technology Việt Nam

Array

superwellvn — Wed, 14 Oct 2020 07:46:33 +0000

As various electronic products such as portable devices have gotten smaller, several chips have been unified in order to secure mounting space. This reduces the cost of mounting and the ripple voltage.
High Performance & Space Saving
High Performance Product for the Mounting Area Reduction

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Low ESL

superwellvn — Wed, 14 Oct 2020 07:39:58 +0000

MLCCs with low equivalent series inductance (ESL) can be used in circuits with limited mounting area, as a small quantity of such MLCCs can sufficiently replace high-speed IC MLCCs.
Faster Energy Transfer
Saving Space by One Chip

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Low Acoustic Noise

superwellvn — Wed, 14 Oct 2020 07:27:24 +0000

MLCC tremors can occur due to piezoelectric phenomena in electronic devices. These tremors are transmitted to the substrate, causing the substrate to tremble, producing audible noise (20Hz~20kHz). Low Acoustic Noise products are a solution that can effectively reduce this noise.
Reducing Audible Noise
A Solution to Reduce the Noise of Mechanical Vibrations caused by Piezoelectric Properties
Pin to Pin Solution
A Solution to Establish Noise Reduction Measures by Replacing Existing Products Immediately

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Fail Safe(Soft Termination 5mm)

superwellvn — Wed, 14 Oct 2020 07:19:01 +0000

Series Design
Designed to operate like two MLCCs in a series
Even if a defect such as a crack occurs on one side, the circuit can be protected on the other side
5mm Bending Guarantee
Guarantee No Bending Cracks for Board Flex 5mm Variants

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ESD Protection

superwellvn — Wed, 14 Oct 2020 06:56:13 +0000

Specialized for use in protecting circuits from ESD, this component guarantees a higher level of ESD than typical MLCC products. It meets the IEC 61000-4-2 standard.
IEC 61000-4-2 Standard ESD Testing according to the IEC 61000-4-2 Standard
DC Bias Stability Improved DC Bias Characteristics Compared to General MLCC

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High Bending Strength(General)

superwellvn — Wed, 14 Oct 2020 06:44:30 +0000

The thermal/mechanical stress on the chip can be reduced by the ductile properties of Soft Termination. It is also resistant to stress caused by board bending.
Relax The Applied External Stress
Able to Reduce External Thermal/Mechanical Stress on the Chip
Excellent Bending Strength

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Embedded/LSC

superwellvn — Wed, 14 Oct 2020 04:49:28 +0000

This can be mounted between the solder balls to deal with thin devices or modules. It can reduce the thickness of the module or be embedded inside the board to secure the mounting area. It can supply current quickly in a stable manner to high-speed AP of mobile devices. In addition it helps remove high-frequency noise, suffering less from external environmental stress.
Thin in terms of Thickness
A thickness that is appropriate for the thin device and module
Removing High Frequency Noise

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Normal

superwellvn — Tue, 13 Oct 2020 09:18:19 +0000

A general MLCC temporarily charges and remove noise in electronic circuits, and is the most broadly available chip type of capacitor. The product line allows
for realization of various sizes and a wide range of capacitance. It also has the structural capacity to mount chips on a PCB at a high speed.

Wide Selection of Size & Wide Capacitance Range

Excellent DC Bias Characteristics

High Speed Automatic Chip Placement on PCBs

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CL Low Inductance Cap

superwellvn — Tue, 13 Oct 2020 08:36:18 +0000

Low ESL capacitor with reversed LW
For high frequency decoupling applications

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CA Array

superwellvn — Tue, 13 Oct 2020 08:31:47 +0000

Board space saving
Time-saving mounting process
Reduction in number of solder joints
Simpler PCB design

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