Embedded/LSC

This can be mounted between the solder balls to deal with thin devices or modules. It can reduce the thickness of the module or be embedded inside the board to secure the mounting area. It can supply current quickly in a stable manner to high-speed AP of mobile devices. In addition it helps remove high-frequency noise, suffering less from external environmental stress.
Thin in terms of Thickness
A thickness that is appropriate for the thin device and module
Removing High Frequency Noise